Semiconductor manufacturing equipment, inspection and failure analysis and material supplier
Solder Ball on BGA Substrate
Single & Array transducer on Acoustic Microscope
Photon Emission Microscope
We are a Singapore company established in 2004 offering semiconductor manufacturing equipment such as solder spheres/copper pillar/micro bumps mounting system on substrates and wafer, conventional ceramic heater & laser heater thermal compression flip chip bonders, surface activated bonders for wafers, failure analysis tools such as acoustic microscope, infrared red microscope, photon & thermal emission microscope, laser-based fault isolation microscope, precision mold parts and saw singulation jigs..etc