Fast temperature ramp up and cooling by laser heater

Temperature deformation of the heater is minimized to enable accurate gap control for bonding

Bonding Accuracy : ±2 micron

Automatic calibration mechanism stabilises accuracy by cancelling positional drift over time

Options:

Tool head and various attachment

Exclusive air cooling mechanism

Pulse heater for large chip sizes: Max 20mm

Low force head (min. 0.2N)

Mapping software