MicroBall Mounter
Fully Auto Solder Ball Mounter for wafers
Flux printing with our unique cup method for micro ball placement
Ball centering mechanism achieves high-accuracy placement on pad
High accuracy vision system alignment with wafer thickness detection function
Ball Size : 0.05 to 0.3mm diameter
Cycle Time: 42WPH (12-inch, *1 million 60um balls)
SBP662
Fully-Auto Micro Ball Mounter for 12 inch wafer
Semi-Auto Solder Ball Mounter for wafer & Substrate
Flux printing with our unique cup method for micro ball placement
Ball centering mechanism achieves high-accuracy placement on pad
High accuracy vision system alignment with wafer thickness detection function
Ball Size : 0.05 to 0.5mm diameter
Applicable Products : Wafer Level Packages, Electronic Component, Substarte (BGA, CSP…etc)
SBP696
Solder Ball Mounter for wafer (4 to 12 inch) and substrate
Micro Ball Inspection & Repair Machine
This machine perform post ball inspection and repair (rework) on the ball mounted substrate.
It is capable to repair double ball, extra and missing ball, as well as wrong size and ball offset on pad.
Ball Size : min 0.05mm diameter
Inspection Range : Max 250m (W) x 330 (L) mm
Substrate Size : Max 260 (W) x 340 (L) mm
Applicable Products : BGA, CSP, PLP, Substrate level bumping
SBM385
Microball Inspection and Repair machine (Rework System)
Fully-Auto Solder Ball Mounter for Substrate
Fully Auto Solder ball mounter high throughput for BGA substrate production.
Flux application by pin transfer which can conform to substrate warpage.
Proprietary ball floating and absorption ball mount head to prevent solder ball damage.
In-Line System with loader, inspection module, reflow oven, flux cleaner and unloader.
Ball Size : min 0.15mm diameter
Substrate Size : Max 100 (W) x 300 (L) mm
Applicable Products : BGA substrate, Flip Chip BGA singulated on tray or jig
SBM371
Fully-Auto Solder Ball Mounter for BGA Substrate